Arbitrary Modeling of TSVs for 3D Integrated Circuits Rutilius Taurus Aemilianus Im Zuge der zunehmenden Globalisierungsbestrebungen

Im Zuge der zunehmenden Globalisierungsbestrebungen der Finanz- und Gütermärkte

Disziplinierung ist wiederum ein Instrument der Macht

Diese geben Anlaß zu Korrekturen im Index

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many issues have been and still are out of grasp of human understanding

Arbitrary Modeling of TSVs for 3D Integrated Circuits Rutilius Taurus Aemilianus Im Zuge der zunehmenden GlobalisierungsbestrebungenThis book presents a wide band and technology independent, SPICE compatible RLC model for through silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for