Tecbond 7731F Bulk Packaging Hot Melt Nozzle Type|Single Orifice Standard Nozzle (ANZ016)

Standard Nozzle (ANZ016)

Surebonder Nozzle Pack Works With

Ring & ball softening point (ASTM E28): 235ºF

Difficult to bond packaging substrates

medium volume hot melt gun that uses 3M's specialized low temp TC glue sticks

Tecbond 7731F Bulk Packaging Hot Melt Nozzle Type|Single Orifice Standard Nozzle (ANZ016)Power Adhesives Tecbond 7731F Hot Melt Adhesive The Power Adhesives 7731F adhesive is a premier universal bulk carton closing hot melt. The Tecbond 7731F adhesive has a fast set speed and is ideal for a wide range of carton closing and case sealing applications. It also maintains good bond integrity at a fairly wide range of temperatures. This hot melt is also used in a number of microwave packaging products. Contact us for samples or skid pricing.