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Bostik Thermogrip H1714 Hot Melt Adhesive Brand|Melt Pro This nozzle has a

SKU 6916230760
4.8
Description

This nozzle has a

This kit includes the essential tools needed to complete repairs efficiently

ITW-L19968

Each adhesive has unique bond characteristics and open time

and alarm applications

Bostik Thermogrip H1714 Hot Melt Adhesive Brand|Melt Pro This nozzle has aBostik Thermogrip H1714 Overview H1714 is a low application temperature hot melt adhesive for case forming and sealing applications. H1714 is a product specifically designed to provide very low application temperatures (250F to 275F) while still providing fiber tearing bonds over a wide temperature range on a variety of substrates. Key Features Low application temperature Clean running Fiber tearing bonds on a variety of board stocks

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